An LED module includes a circuit board, multiple LEDs, and multiple electronic components for constituting a power supply circuit for lighting the multiple LEDs. The multiple LEDs are disposed on a first surface of the circuit board. The multiple electronic components are disposed on a second surface of the circuit board opposite to the first surface. At least some of the multiple electronic components are arranged so as to surround projections of the multiple LEDs projected onto the second surface of the circuit board in a thickness direction of the circuit board.