Invention Grant
- Patent Title: Probe card
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Application No.: US14192107Application Date: 2014-02-27
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Publication No.: US10088503B2Publication Date: 2018-10-02
- Inventor: Ming-Cheng Hsu
- Applicant: Taiwan Semiconductor Manufacturing CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: G01R1/073
- IPC: G01R1/073

Abstract:
An apparatus and a method are disclosed herein. The apparatus includes a circuit board, a housing, a spacer and a pin. The circuit board is configured to test a device-under-test (DUT). The housing includes a raised portion and a supporting portion. The spacer is mounted on the supporting portion of the housing. The pin penetrates through the raised portion and the supporting portion of the housing, and is configured to electrically connect the circuit board to the DUT.
Public/Granted literature
- US20150241471A1 Probe Card Public/Granted day:2015-08-27
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