Invention Grant
- Patent Title: Temperature compensation circuit and sensor device
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Application No.: US15165445Application Date: 2016-05-26
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Publication No.: US10088532B2Publication Date: 2018-10-02
- Inventor: Minoru Ariyama
- Applicant: SII Semiconductor Corporation
- Applicant Address: JP Chiba
- Assignee: ABLIC INC.
- Current Assignee: ABLIC INC.
- Current Assignee Address: JP Chiba
- Agency: Brinks Gilson & Lione
- Priority: JP2015-112309 20150602
- Main IPC: G05D23/24
- IPC: G05D23/24 ; G01R33/00 ; H03K17/14 ; G01R33/07

Abstract:
Provided is a temperature compensation circuit capable of solely and independently adjusting a temperature compensation amount. The temperature compensation circuit includes: a first temperature compensation voltage terminal connected to a node between a first resistor and a second resistor; a second temperature compensation voltage terminal connected to a node between a third resistor and a fourth resistor; a first voltage terminal formed at a node between the first resistor and the fourth resistor; a second voltage terminal formed at a node between the second resistor and the third resistor; a fifth resistor connected between a power supply terminal and the first voltage terminal; and a sixth resistor connected between a ground terminal and the second voltage terminal.
Public/Granted literature
- US20160356862A1 TEMPERATURE COMPENSATION CIRCUIT AND SENSOR DEVICE Public/Granted day:2016-12-08
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