Invention Grant
- Patent Title: Lens array and manufacturing method therefor, solid-state imaging apparatus, and electronic apparatus
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Application No.: US15021764Application Date: 2014-09-12
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Publication No.: US10088608B2Publication Date: 2018-10-02
- Inventor: Yoichi Ootsuka , Kenju Nishikido , Ippei Yoshiba
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2013-197861 20130925
- International Application: PCT/JP2014/074244 WO 20140912
- International Announcement: WO2015/045914 WO 20150402
- Main IPC: G02B3/08
- IPC: G02B3/08 ; G02B3/00 ; H01L27/146 ; G02B1/113 ; G02B7/34 ; H04N5/369 ; G03B13/36

Abstract:
The present technology relates to a lens array and a manufacturing method therefor, a solid-state imaging apparatus, and an electronic apparatus that can improve the AF performance while suppressing the deterioration of image quality. A lens array includes microlenses that are formed corresponding to phase difference detection pixels that are provided to be mixed in imaging pixels. Each of the microlenses is formed such that a lens surface thereof is a substantially spherical surface, the microlens has a rectangular shape in a planar view and four corners are not substantially rounded, and a bottom surface in vicinity of an opposite-side boundary portion that includes an opposite-side center portion of a pixel boundary portion in a cross-sectional view is higher than a bottom surface in vicinity of a diagonal boundary portion that includes a diagonal boundary portion. The present technology is applicable to a lens array of a CMOS image sensor, for example.
Public/Granted literature
- US20160231468A1 LENS ARRAY AND MANUFACTURING METHOD THEREFOR, SOLID-STATE IMAGING APPARATUS, AND ELECTRONIC APPARATUS Public/Granted day:2016-08-11
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