The invention is related to a method of manufacturing of a composite substrate comprising an embedded electronic device by forming in a first substrate a cavity for receiving the electronic device; disposing the electronic device between the first substrate and a second substrate in said cavity; providing a solvent of cellulose acetate in-between the first substrate and the second substrate, maintaining the first substrate and the second substrate in contact together, wherein the electronic device is maintained between the first substrate and the second substrate, forming the composite substrate.