A method for embossing at least one microstructure or nanostructure with an embossing die that has at least one embossing structure with the following steps, in particular the following sequence: aligning the embossing structure of the embossing die relative to a metering device, metering an embossing material in the embossing structure by means of the metering device, at least partial hardening of the embossing material and embossing of the embossing material, characterized in that the embossing structures point in a gravitational direction (G) at least in the case of the metering. In addition, the invention relates to a corresponding device.