- Patent Title: Integrated circuits and methods of design and manufacture thereof
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Application No.: US15681934Application Date: 2017-08-21
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Publication No.: US10089430B2Publication Date: 2018-10-02
- Inventor: Henning Haffner , Manfred Eller , Richard Lindsay
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L21/28 ; H01L21/8234 ; H01L27/02 ; G03F1/00 ; H01L27/082 ; H01L27/085 ; H01L21/033 ; H01L27/088 ; H01L29/66 ; H01L29/78

Abstract:
Integrated circuits and methods of manufacture and design thereof are disclosed. For example, a method of manufacturing includes using a first mask to pattern a gate material forming a plurality of first and second features. The first features form gate electrodes of the semiconductor devices, whereas the second features are dummy electrodes. Based on the location of these dummy electrodes, selected dummy electrodes are removed using a second mask. The use of the method provides greater flexibility in tailoring individual devices for different objectives.
Public/Granted literature
- US20170344690A1 Integrated Circuits and Methods of Design and Manufacture Thereof Public/Granted day:2017-11-30
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