Invention Grant
- Patent Title: Stray inductance reduction in packaged semiconductor devices and modules
-
Application No.: US15449473Application Date: 2017-03-03
-
Publication No.: US10090279B2Publication Date: 2018-10-02
- Inventor: Seungwon Im , Mankyo Jong , ByoungOk Lee , Joonseo Son , Oseob Jeon
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: Semiconductor Components Industries, LLC
- Current Assignee: Semiconductor Components Industries, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Brake Hughes Bellermann LLP
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/31 ; H01L29/739

Abstract:
In a general aspect, an apparatus can include a first substrate operatively coupled with a second substrate. The apparatus can also include a power supply terminal assembly including a first power supply terminal aligned along a first plane, the first power supply terminal being electrically coupled with the first substrate. The power supply terminal assembly can also include a second power supply terminal aligned along a second plane, the second power supply terminal being electrically coupled with the second substrate. The power supply terminal assembly can further include a power supply terminal frame having an isolation portion disposed between the first power supply terminal and the second power supply terminal and a retention portion disposed around a portion of the first power supply terminal and disposed around a portion of the second power supply terminal.
Public/Granted literature
- US20180254262A1 STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES AND MODULES Public/Granted day:2018-09-06
Information query
IPC分类: