Invention Grant
- Patent Title: CMOS image sensor chips with stacked scheme and methods for forming the same
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Application No.: US13571099Application Date: 2012-08-09
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Publication No.: US10090349B2Publication Date: 2018-10-02
- Inventor: Meng-Hsun Wan , Szu-Ying Chen , Dun-Nian Yaung , Jen-Cheng Liu
- Applicant: Meng-Hsun Wan , Szu-Ying Chen , Dun-Nian Yaung , Jen-Cheng Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A device includes an image sensor chip having an image sensor therein. A read-out chip is underlying and bonded to the image sensor chip, wherein the read-out chip includes a logic device selected from the group consisting essentially of a reset transistor, a source follower, a row selector, and combinations thereof therein. The logic device and the image sensor are electrically coupled to each other, and are parts of a same pixel unit. A peripheral circuit chip is underlying and bonded to the read-out chip, wherein the peripheral circuit chip includes a logic circuit.
Public/Granted literature
- US20140042298A1 CMOS Image Sensor Chips with Stacked Scheme and Methods for Forming the Same Public/Granted day:2014-02-13
Information query
IPC分类: