An electronic package adapted for connection to a rear frame member of an electric machine. The electronic package includes a cooling tower having first and second axial ends and a central axis. The cooling tower includes a metallic first wall extending about the central axis and defining radially inner and outer first wall surfaces. An axially extending air flow passage extends through the cooling tower. Spaced metallic ribs traverse the air flow space and are in conductive thermal communication with the radially inner first wall surface. A plurality of circumferentially distributed power electronics devices are in conductive thermal communication with the cooling tower and secured to the radially outer first wall surface to thereby provide a heat sink for the power electronics devices. Electronic control circuitry is operatively connected to and substantially surrounded by the power electronics devices. An electric machine with such an electronic package is also disclosed.