Invention Grant
- Patent Title: Multilevel driver for high speed chip-to-chip communications
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Application No.: US15918851Application Date: 2018-03-12
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Publication No.: US10091033B2Publication Date: 2018-10-02
- Inventor: Roger Ulrich
- Applicant: Kandou Labs, S.A.
- Applicant Address: CH Lausanne
- Assignee: KANDOU LABS, S.A.
- Current Assignee: KANDOU LABS, S.A.
- Current Assignee Address: CH Lausanne
- Agency: Invention Mine, LLC
- Main IPC: H04L25/03
- IPC: H04L25/03 ; H04B3/04 ; H04L25/49
Abstract:
Transmission line driver systems are described which are comprised of multiple paralleled driver elements. The paralleled structure allows efficient generation of multiple output signal levels with adjustable output amplitude, optionally including Finite Impulse Response signal shaping and skew pre-compensation.
Public/Granted literature
- US20180205580A1 MULTILEVEL DRIVER FOR HIGH SPEED CHIP-TO-CHIP COMMUNICATIONS Public/Granted day:2018-07-19
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