Invention Grant
- Patent Title: Electronic device
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Application No.: US15924716Application Date: 2018-03-19
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Publication No.: US10091869B1Publication Date: 2018-10-02
- Inventor: Yuan-Yu Chien
- Applicant: AU Optronics Corporation
- Applicant Address: TW Hsin-Chu
- Assignee: AU OPTRONICS CORPORATION
- Current Assignee: AU OPTRONICS CORPORATION
- Current Assignee Address: TW Hsin-Chu
- Agency: WPAT, PC
- Priority: TW106144112A 20171215
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/14 ; B32B7/12 ; B32B3/08 ; H05K5/00

Abstract:
An electronic device includes a housing, a circuit board, and a conductive adhesive element tape. The circuit board has a first board surface facing the housing and a second board surface facing opposite the housing. The circuit board has a ground pad on the second board surface. The conductive adhesive element tape includes a first portion, a second portion, and a connection portion. The first portion is disposed between the first board surface and the housing. The first portion has a first adhesive surface and a first non-adhesive surface opposite to the first adhesive surface. The first adhesive surface adheres to the housing. The second portion has a second adhesive surface and a second non-adhesive surface opposite to the second adhesive surface. The second adhesive surface adheres to the ground pad. The connection portion connects the first portion and the second portion.
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