Invention Grant
- Patent Title: Ink composition for light sintering, wiring board using same and manufacturing method therefor
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Application No.: US15301341Application Date: 2015-04-01
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Publication No.: US10091875B2Publication Date: 2018-10-02
- Inventor: Yoonjin Kim , Jinwoo Cho , Kwonwoo Shin , Yonggon Seo , Yeonwon Kim , Sanghyeon Jang , Namje Jo
- Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE
- Applicant Address: KR Gyeonggi-Do
- Assignee: Korea Electronics Technology Institute
- Current Assignee: Korea Electronics Technology Institute
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: KR10-2014-0038579 20140401; KR10-2014-0186689 20141223; KR10-2014-0186691 20141223
- International Application: PCT/KR2015/003226 WO 20150401
- International Announcement: WO2015/152625 WO 20151008
- Main IPC: H01B1/22
- IPC: H01B1/22 ; C09D11/00 ; H05K1/09 ; C09D11/52 ; C09D11/037 ; H05K3/12 ; H05K3/22 ; H05K3/02 ; B22F1/02 ; B22F1/00
Abstract:
The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.
Public/Granted literature
- US20170118836A1 INK COMPOSITION FOR LIGHT SINTERING, WIRING BOARD USING SAME AND MANUFACTURING METHOD THEREFOR Public/Granted day:2017-04-27
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