A multilayer structure for an electronic device, includes a flexible substrate film (202, 502) for accommodating electronics, a number of electronic components (308, 508) provided on a first surface area (401A, 501A) of the film, the film also including a second surface area adjacent (401B, 501B) to the first surface area, and a number of conductive traces (412, 512) printed on the substrate film for electrically connecting electronic components together, wherein the number of electronic components and the related first surface area of the substrate accommodating the components have been overmolded with first thermoplastic material (306, 506), the adjacent second surface area and at least part of the first area being overmolded with second thermoplastic material so that at least part of the electronic components and the first thermoplastic material thereon are substantially embedded between the substrate film and second thermoplastic material. A corresponding method of manufacture is presented.