Invention Grant
- Patent Title: Securing mechanism and electronic device with same
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Application No.: US15454091Application Date: 2017-03-09
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Publication No.: US10091910B2Publication Date: 2018-10-02
- Inventor: An-Chih Wu , Mu-Shu Fan , Hsin-Chang Chen , Hung-Yi Kuo , Ming-Chieh Li
- Applicant: AURAS Technology Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: AURAS TECHNOLOGY CO., LTD.
- Current Assignee: AURAS TECHNOLOGY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: WPAT, PC
- Priority: TW106102954A 20170125
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F9/00 ; H01L23/40

Abstract:
A securing mechanism is provided for facilitating attaching a heat dissipation element. The securing mechanism includes a first fixing part, a second fixing part, a first arm and a second arm. The first arm and the second arm are connected with the first fixing part and the second fixing part. A first bent structure is protruded from the first arm and toward the second arm. A second bent structure is protruded from the second arm and toward the first arm. The securing mechanism is fixed on the heat dissipation element through the first fixing part and the second fixing part. The heat dissipation element is pressed by the first bent structure and the second bent structure. Consequently, the heat dissipation element is attached on the heat source.
Public/Granted literature
- US20180213682A1 SECURING MECHANISM AND ELECTRONIC DEVICE WITH SAME Public/Granted day:2018-07-26
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