Invention Grant
- Patent Title: Interface card cooling using heat pipes
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Application No.: US13711052Application Date: 2012-12-11
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Publication No.: US10091911B2Publication Date: 2018-10-02
- Inventor: Matthew J. Kelty
- Applicant: Infinera Corporation
- Applicant Address: US CA Sunnyvale
- Assignee: Infinera Corporation
- Current Assignee: Infinera Corporation
- Current Assignee Address: US CA Sunnyvale
- Agent David L. Soltz
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A device may have: a frame section having a cage with a first receiving portion and a second receiving portion, the second receiving portion receiving a module; a first plate having an end, the first plate being received by the first receiving portion; a heat pipe having a first end attached to the end of the first plate and having a second end; a second plate attached to the second end of the heat pipe; and a spring attached to the first plate to bias the first plate against the module, the first plate being capable of receiving heat dissipated by the module, the heat pipe being capable of receiving the heat received by the first plate and transferring the heat to the second plate, the second plate receiving the heat transferred by the heat pipe and dissipating the received heat.
Public/Granted literature
- US20140160679A1 INTERFACE CARD COOLING UISNG HEAT PIPES Public/Granted day:2014-06-12
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