Invention Grant
- Patent Title: Cu—Be alloy and method for producing same
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Application No.: US14693120Application Date: 2015-04-22
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Publication No.: US10094002B2Publication Date: 2018-10-09
- Inventor: Hiromi Miura , Naokuni Muramatsu
- Applicant: NGK Insulators, Ltd. , The University of Electro-Communications
- Applicant Address: JP Nagoya JP Chofu
- Assignee: NGK Insulators, Ltd.,The University of Electro-Communications
- Current Assignee: NGK Insulators, Ltd.,The University of Electro-Communications
- Current Assignee Address: JP Nagoya JP Chofu
- Agency: Burr & Brown, PLLC
- Priority: JP2012-242498 20121102
- Main IPC: C22C9/00
- IPC: C22C9/00 ; C22F1/08 ; H01B1/02 ; H01B13/00 ; C22F1/00

Abstract:
A Cu—Be alloy according to the present invention is a Co-containing Cu—Be alloy, in which the Co content is 0.005% to 0.12% by mass, and the number of Cu—Co-based compound particles having a particle size of 0.1 μm or more that can be confirmed on a TEM image at a magnification of 20,000 is five or less in a field of view of 10 μm×10 μm. Furthermore, a method for producing a Cu—Be alloy according to the present invention includes a solution annealing treatment step of subjecting a Cu—Be alloy raw material containing 0.005% to 0.12% by mass of Co and 1.60% to 1.95% by mass of Be to solution annealing treatment to obtain a solution-annealed material.
Public/Granted literature
- US20150225817A1 Cu-Be ALLOY AND METHOD FOR PRODUCING SAME Public/Granted day:2015-08-13
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