Invention Grant
- Patent Title: Substrate processing apparatus and method of fabricating substrate loading unit
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Application No.: US14854066Application Date: 2015-09-15
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Publication No.: US10094022B2Publication Date: 2018-10-09
- Inventor: Manabu Honma
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2014-194180 20140924
- Main IPC: C23C16/458
- IPC: C23C16/458 ; H01L21/683 ; H01L21/687 ; C23C16/455

Abstract:
A substrate processing apparatus includes a process chamber in which etching by a corrosive gas is performed to remove a film formed therein after a film formation process, a susceptor disposed in the process chamber and having a substrate loading portion, a stationary shaft passing through the susceptor, a first securing member securing the susceptor at an upper side, a second securing member securing the susceptor at a lower side, a pressing member disposed below the susceptor to urge the stationary shaft in a downward direction while urging the second securing member in an upward direction, and a stopping member formed above the susceptor and engaged with the stationary shaft to urge the first securing member in cooperation with the pressing member. The susceptor, the first securing member and the stopping member are made of a material having corrosion resistance higher than the pressing member.
Public/Granted literature
- US20160083841A1 SUBSTRATE PROCESSING APPARATUS AND METHOD OF FABRICATING SUBSTRATE LOADING UNIT Public/Granted day:2016-03-24
Information query
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