Invention Grant
- Patent Title: Method of manufacturing multilayer body, method of processing substrate, and multilayer body
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Application No.: US14127315Application Date: 2012-05-31
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Publication No.: US10094024B2Publication Date: 2018-10-09
- Inventor: Yasushi Fujii , Tatsuhiro Mitake , Atsushi Matsushita
- Applicant: Yasushi Fujii , Tatsuhiro Mitake , Atsushi Matsushita
- Applicant Address: JP Kawasaki-Shi
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2011-141267 20110624
- International Application: PCT/JP2012/064239 WO 20120531
- International Announcement: WO2012/176607 WO 20121227
- Main IPC: C23C16/50
- IPC: C23C16/50 ; H01L21/02 ; H01L21/683 ; C23C16/26 ; C23C16/505
Abstract:
A method for forming a release layer which lies between a substrate and a supporting member and has a property that changes when the release layer absorbs light coming through the supporting member, by carrying out plasma CVD with a high-frequency power that is set so as to be higher than a power at which a mode jump occurs.
Public/Granted literature
- US20140141253A1 METHOD OF MANUFACTURING MULTILAYER BODY, METHOD OF PROCESSING SUBSTRATE, AND MULTILAYER BODY Public/Granted day:2014-05-22
Information query
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