Invention Grant
- Patent Title: System for forming floor underlayment
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Application No.: US15715575Application Date: 2017-09-26
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Publication No.: US10094126B2Publication Date: 2018-10-09
- Inventor: Alan B. Collison , Akiva Pinto , Reid Borgman
- Applicant: MP Global Products, L.L.C.
- Applicant Address: US NE Norfolk
- Assignee: MP Global Products, L.L.C.
- Current Assignee: MP Global Products, L.L.C.
- Current Assignee Address: US NE Norfolk
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: E04F15/22
- IPC: E04F15/22 ; E04F15/18 ; E04B1/66 ; B32B21/10 ; E04C2/24 ; E04C2/16

Abstract:
A process for making a fibrous panel member and a flooring structure is disclosed. The flooring structure has a subfloor, a surface layer, and an insulative pad disposed between the subfloor and the surface layer. The insulative pad has an MDI binder and reinforcement fibers distributed uniformly and randomly within a first plane. The process includes mixing a porous fiber material with a MDI adhesive. The fiber batt is compressed between a pair of porous belts. Steam and heat are applied to the compressed batt to form a bound flexible batting material.
Public/Granted literature
- US20180016799A1 SYSTEM FOR FORMING FLOOR UNDERLAYMENT Public/Granted day:2018-01-18
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