Invention Grant
- Patent Title: Silicone resin film, curable silicone resin composition, optical semiconductor device, and packaging method for optical semiconductor device
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Application No.: US15408439Application Date: 2017-01-18
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Publication No.: US10096754B2Publication Date: 2018-10-09
- Inventor: Shih-Chieh Teng , Ju-Hui Huang
- Applicant: BenQ Materials Corporation
- Applicant Address: TW Taoyuan
- Assignee: BenQ Materials Corporation
- Current Assignee: BenQ Materials Corporation
- Current Assignee Address: TW Taoyuan
- Agency: CKC & Partners Co., Ltd.
- Priority: TW105128102A 20160831
- Main IPC: C09D183/04
- IPC: C09D183/04 ; H01L33/56 ; C08L83/04 ; C09J183/04 ; C08G77/12 ; C08G77/20

Abstract:
The disclosure provides a silicone resin film comprising a release substrate and a silicone resin coating layer formed by coating a curable silicone resin composition on the release substrate and curing the curable silicon resin composition, wherein the silicone resin composition comprises 10 to 25 parts by weight of linear polysiloxane; 40 to 55 parts by weight of a first silicone resin wherein the first silicone resin have at least following siloxane units represented by the general formulas: R1SiO3/2 and a R22SiO2/2, wherein the molar fraction of R1SiO3/2 unit is present in the range of 0.60 to 0.75 in the general formula; 15 to 30 parts by weight of a second silicone resin; 15 to 25 parts by weight of a Si—H containing polysiloxane; a platinum group metal catalyst and phosphor powder.
Public/Granted literature
Information query
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