A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.