Invention Grant
- Patent Title: Thermal management systems for electronics
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Application No.: US15213212Application Date: 2016-07-18
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Publication No.: US10098260B2Publication Date: 2018-10-09
- Inventor: Scott R. Bouras , Kris H. Campbell , Shin Katsumata , Charles Shepard
- Applicant: Hamilton Sundstrand Corporation
- Applicant Address: US NC Charlotte
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US NC Charlotte
- Agency: Locke Lord LLP
- Agent Daniel J. Fiorello; Scott D. Wofsy
- Main IPC: F25D23/12
- IPC: F25D23/12 ; H05K7/20

Abstract:
A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.
Public/Granted literature
- US20180020573A1 THERMAL MANAGEMENT SYSTEMS FOR ELECTRONICS Public/Granted day:2018-01-18
Information query
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