Invention Grant
- Patent Title: One-piece process kit shield for reducing the impact of an electric field near the substrate
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Application No.: US15260190Application Date: 2016-09-08
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Publication No.: US10103012B2Publication Date: 2018-10-16
- Inventor: William Johanson , Kirankumar Savandaiah
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Priority: IN2866/DEL/2015 20150911
- Main IPC: H01J37/34
- IPC: H01J37/34 ; H01J37/32 ; C23C14/34 ; C23C14/56

Abstract:
Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments, a one-piece process kit shield configured for use in a processing chamber for processing a substrate having a given diameter includes: a cylindrical body having an upper portion and a lower portion; an annular heat transfer channel disposed within the upper portion; and a cover ring section extending radially inward from the lower portion and having an annular leg extending from a bottom surface of the cover ring section, wherein the annular leg is configured to interface with a deposition ring to form a tortuous path between the bottom surface and the deposition ring.
Public/Granted literature
- US20170076924A1 ONE-PIECE PROCESS KIT SHIELD FOR REDUCING THE IMPACT OF AN ELECTRIC FIELD NEAR THE SUBSTRATE Public/Granted day:2017-03-16
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