A packing method for a semiconductor device includes a step of preparing the semiconductor device that has a sealing body having a principal surface and a plurality of leads, and a step of preparing a base carrier tape that has a peripheral portion, a step portion, and a pocket portion. The method further includes a step of placing the semiconductor device in the pocket portion, a step of bonding a cover tape to the step portion in such a manner that the sealing body is pressed against the base carrier tape, and a step of winding the base carrier tape with the semiconductor device placed therein and with the cover tape bonded thereto, around a tape reel. The base carrier tape includes a principal surface of the peripheral portion, a principal surface of the step portion, and a principal surface of the pocket portion.