Invention Grant
- Patent Title: Chip package structure and method for forming the same
-
Application No.: US15362690Application Date: 2016-11-28
-
Publication No.: US10103125B2Publication Date: 2018-10-16
- Inventor: Chen-Hua Yu , Jing-Cheng Lin , Po-Hao Tsai , An-Jhih Su
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L21/78 ; H01L23/60
Abstract:
A chip package structure is provided. The chip package structure includes a chip structure. The chip package structure includes a first ground bump below the chip structure. The chip package structure includes a conductive shielding film disposed over the chip structure and extending onto the first ground bump. The conductive shielding film is electrically connected to the first ground bump.
Public/Granted literature
- US20180151540A1 CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2018-05-31
Information query
IPC分类:
