Invention Grant
- Patent Title: Thin film transistor substrate
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Application No.: US15750994Application Date: 2016-04-19
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Publication No.: US10103276B2Publication Date: 2018-10-16
- Inventor: Takashi Imazawa , Toshiaki Fujino , Tsukasa Motoya
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-212476 20151029
- International Application: PCT/JP2016/062298 WO 20160419
- International Announcement: WO2017/073097 WO 20170504
- Main IPC: H01L29/786
- IPC: H01L29/786 ; G02F1/1333 ; H01L27/12 ; G02F1/1368

Abstract:
A thin film transistor substrate includes: a plurality of pixels arranged in a matrix, each of the pixels including: a thin film transistor including: a gate electrode made of a metal and disposed on the substrate; a gate insulating film covering at least the gate electrode; a semiconductor layer including an oxide semiconductor provided at a position facing the gate electrode with the gate insulating film interposed therebetween; a source electrode and a drain electrode in contact with the semiconductor layer; and an interlayer insulating film provided on at least the semiconductor layer, the source electrode, and the drain electrode; and a pixel electrode electrically connected to the drain electrode. The gate electrode has hydrogen occlusion capability of 2.5×1020 to 2×1022 atoms/cm3, and the semiconductor layer has a hydrogen concentration of 1×1016 atoms/cm3 or less.
Public/Granted literature
- US20180233594A1 THIN FILM TRANSISTOR SUBSTRATE Public/Granted day:2018-08-16
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