Invention Grant
- Patent Title: In-place clamping of pin-grid array
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Application No.: US15825600Application Date: 2017-11-29
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Publication No.: US10103463B1Publication Date: 2018-10-16
- Inventor: Steven Michael Hughes
- Applicant: ColdQuanta, Inc.
- Applicant Address: US CO Boulder
- Assignee: ColdQuanta, Inc.
- Current Assignee: ColdQuanta, Inc.
- Current Assignee Address: US CO Boulder
- Agency: Clifton Leon Anderson
- Main IPC: H01R12/70
- IPC: H01R12/70 ; H01R13/52 ; H01R12/91 ; H01R13/04 ; H01R12/71

Abstract:
An atomtronic (e.g., ultra-cold-matter physics or ion-trap) system includes a vacuum-cell structure, an integrated-circuit package with a pin-grid array, and a socket for interfacing the integrated-circuit package with external control and monitoring systems. After pins of the pin-grid array are inserted into holes of plates in the socket, the plates are moved in opposite directions so that contacts within the holes clamp in place the pins, providing electrical connections. The in-place clamping avoids stress at the seal between the integrated circuit package and the vacuum cell structure; thus, stress that could otherwise compromise the vacuum seal is avoided so as to yield a more reliable vacuum.
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