Invention Grant
- Patent Title: Printed wiring board and method of producing the same
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Application No.: US15010733Application Date: 2016-01-29
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Publication No.: US10104765B2Publication Date: 2018-10-16
- Inventor: Yoshitaka Toyota , Kengo Iokibe , Yuki Yamashita , Masanori Naito , Toshiyuki Kaneko , Kiyohiko Kaiya , Toshihisa Uehara , Koichi Kondo
- Applicant: National University Corporation Okayama University , KYOCERA Circuit Solutions, Inc.
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2015-017995 20150130
- Main IPC: H05K1/02
- IPC: H05K1/02
Abstract:
A printed wiring board includes a digital circuit, an analog circuit, and a power supply path that is disposed on an insulating layer between the digital circuit and the analog circuit. EBG unit cells are disposed on a boundary between the digital circuit and the analog circuit one dimensionally or two dimensionally and periodically, and an interdigital electrode is formed. A magnetic body film is formed over the printed wiring board, partially formed on the EBG unit cells, or formed avoiding the EBG unit cells.
Public/Granted literature
- US20160227643A1 PRINTED WIRING BOARD AND METHOD OF PRODUCING THE SAME Public/Granted day:2016-08-04
Information query
