Invention Grant
- Patent Title: Flexible printed wiring board
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Application No.: US15558371Application Date: 2015-11-20
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Publication No.: US10104774B2Publication Date: 2018-10-16
- Inventor: Fumihiko Matsuda
- Applicant: NIPPON MEKTRON, LTD.
- Applicant Address: JP Tokyo
- Assignee: NIPPON MEKTRON, LTD.
- Current Assignee: NIPPON MEKTRON, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2015-052697 20150316
- International Application: PCT/JP2015/082656 WO 20151120
- International Announcement: WO2016/147487 WO 20160922
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/14 ; H05K1/02 ; H05K1/03

Abstract:
Provided is a flexible printed wiring board capable of increasing the number of wires even when the board is used in a narrow arrangement space and enhancing the degree of freedom for design while maintaining the board in a self-supported state. A flexible printed wiring board 100 is used in a state, in which one and another ends in a longitudinal direction are fixed respectively to one and another members that move in relation to each other in a state of being bent to be curved in the longitudinal direction. The flexible printed wiring board includes wiring board units 100A and 100B in which a plurality of wires are formed on a flexible insulating substrate and which are molded in a state of being curved in a lateral direction, and adjacent wiring board units are partially connected at side edges thereof in the lateral direction.
Public/Granted literature
- US20180084644A1 FLEXIBLE PRINTED WIRING BOARD Public/Granted day:2018-03-22
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