Invention Grant
- Patent Title: Board, semiconductor fabrication plant (FAB) and fabrication facility
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Application No.: US15017559Application Date: 2016-02-05
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Publication No.: US10104816B2Publication Date: 2018-10-16
- Inventor: Chwen Yu , Chih-Ming Tsao
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H05K9/00
- IPC: H05K9/00 ; G12B17/00 ; G12B17/02 ; H01J37/09 ; H01J37/30
Abstract:
A board includes a first magnetic conductive plate and a second magnetic conductive plate. The first magnetic conductive plate has a first magnetic conductive direction. The second magnetic conductive plate overlaps with the first magnetic conductive plate. The second magnetic conductive plate has a second magnetic conductive direction. The first magnetic conductive direction and the second magnetic conductive direction cross.
Public/Granted literature
- US20170229278A1 BOARD, SEMICONDUCTOR FABRICATION PLANT (FAB) AND FABRICATION FACILITY Public/Granted day:2017-08-10
Information query
