Invention Grant
- Patent Title: Method for adhering structures using silicone adhesive system
-
Application No.: US15106044Application Date: 2014-11-12
-
Publication No.: US10106712B2Publication Date: 2018-10-23
- Inventor: John H. Vontell , Jesse C. Meyer , Charles R. Watson
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee Address: US CT Farmington
- Agency: Cantor Colburn LLP
- International Application: PCT/US2014/065158 WO 20141112
- International Announcement: WO2015/094521 WO 20150625
- Main IPC: C09J183/04
- IPC: C09J183/04 ; C09J5/02 ; C08G77/20
Abstract:
A method of adhering a first structure to a second structure using a primer, containing a primer fugitive inhibitor, and a film adhesive by removing the primer fugitive inhibitor under vacuum at room temperature conditions.
Public/Granted literature
- US20160319172A1 METHOD FOR ADHERING STRUCTURES USING SILICONE ADHESIVE SYSTEM Public/Granted day:2016-11-03
Information query
IPC分类:
