An electronic device able to identify fingerprints ultrasonically includes a substrate, a fingerprint identification structure, and an adhesive layer. The fingerprint identification structure includes a thin film transistor (TFT) substrate and a flexible printed circuit (FPC). The FPC includes a first portion and a second portion. The first portion is located on a surface of the TFT substrate facing away from the substrate. The second portion is extended from an end of the first portion to be electrically connected to a surface of the TFT substrate facing the substrate. The second portion is separated from the adhesive layer. A space is defined between the second portion and the substrate. The adhesive layer is susceptible to deformation and decomposition from environmental conditions.