A method for forming an out of plane structure includes depositing a layer of an elastic material on a substrate wherein the elastic material has an intrinsic stress profile. The layer of elastic material is photolithographically patterned into at least two spaced-apart elastic members. An electrically non-conductive tether layer joins the elastic members. A portion of the substrate is etched under the elastic members to release a free end of each elastic member, while leaving an anchor portion of each elastic member fixed to the substrate. The stress profile of the elastic members biases the free ends of the elastic members away from the substrate forming loops. The structure is electroplated by applying a voltage having a first polarity between an anode and the structure while the structure is in an electroplating bath. Subsequent to the electroplating, the polarity of the voltage between the anode and the structure is reversed.