Invention Grant
- Patent Title: Polymerization method for preparing conductive polymer
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Application No.: US14661662Application Date: 2015-03-18
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Publication No.: US10109421B2Publication Date: 2018-10-23
- Inventor: Antony P Chacko , Yaru Shi , John Ols
- Applicant: Kemet Electronics Corporation
- Applicant Address: US SC Simpsonville
- Assignee: KEMET Electronics Corporation
- Current Assignee: KEMET Electronics Corporation
- Current Assignee Address: US SC Simpsonville
- Agency: Patent Filing Specialist, Inc.
- Agent Joseph T. Guy
- Main IPC: H01G9/025
- IPC: H01G9/025 ; H01G4/08 ; H01G9/00 ; C08L65/00 ; H01G9/028 ; H01B1/12 ; C08G75/06 ; H01G4/005 ; C08L25/18 ; C08L71/02

Abstract:
A improved process for preparing a conductive polymer dispersion is provided as is an improved method for making capacitors using the conductive polymer. The process includes providing a monomer solution and shearing the monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer. The droplets of monomer are then polymerized during shearing to form the conductive polymer dispersion.
Public/Granted literature
- US20150194263A1 Polymerization Method for Preparing Conductive Polymer Public/Granted day:2015-07-09
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