Invention Grant
- Patent Title: Measuring device and method for measuring layer thicknesses and defects in a wafer stack
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Application No.: US13883777Application Date: 2010-11-12
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Publication No.: US10109538B2Publication Date: 2018-10-23
- Inventor: Markus Wimplinger
- Applicant: Markus Wimplinger
- Applicant Address: AT St. Florian am Inn
- Assignee: EV Group E.Thallner GmbH
- Current Assignee: EV Group E.Thallner GmbH
- Current Assignee Address: AT St. Florian am Inn
- Agency: Kusner & Jaffe
- International Application: PCT/EP2010/006902 WO 20101112
- International Announcement: WO2012/062343 WO 20120518
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01B7/06 ; G01B11/06 ; G01B17/02 ; G01N29/04 ; G01N29/265 ; G01N29/27 ; G01N29/275 ; H01L21/67 ; G01N21/95
Abstract:
The invention relates to a measurement means and a method for measuring and/or acquiring layer thicknesses and/or voids of one or more layers of a wafer stack on a plurality of measuring points distributed on the wafer stack and a corresponding wafer processing device.
Public/Granted literature
- US20130228015A1 MEASURING DEVICE AND METHOD FOR MEASURING LAYER THICKNESSES AND DEFECTS IN A WAFER STACK Public/Granted day:2013-09-05
Information query
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