Invention Grant
- Patent Title: Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
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Application No.: US15795915Application Date: 2017-10-27
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Publication No.: US10109548B2Publication Date: 2018-10-23
- Inventor: Dirk Robert Walter Leipold , Julio C. Costa , Baker Scott , George Maxim
- Applicant: Qorvo US, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/31 ; H01L21/02 ; H01L21/304 ; H01L21/683 ; H01L23/367 ; H01L21/56 ; H01L23/20 ; H05K1/02 ; H05K1/18 ; H01Q1/50 ; H01L23/36 ; H01L23/373 ; H01L21/306 ; H01L23/00 ; H01L49/02 ; H01L23/522
Abstract:
A printed circuit module having a protective layer in place of a low-resistivity handle layer and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned die attached to the printed circuit substrate. The thinned die is an integrated passive die (IPD) without a silicon substrate layer. A protective layer is disposed over the IPD, wherein the protective layer has a thermal conductivity between 2 watts per meter Kelvin (W/mK) and 6600 W/mK and an electrical resistivity of greater than 106 Ohm-cm.
Public/Granted literature
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