- Patent Title: Package with embedded electronic components and a waveguide cavity through the package cover, antenna apparatus including package, and method of manufacturing the same
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Application No.: US15078527Application Date: 2016-03-23
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Publication No.: US10109604B2Publication Date: 2018-10-23
- Inventor: Ali Eray Topak , Marcel Daniel Blech
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Xsenus LLP
- Priority: EP15161619 20150330
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/538 ; H01Q13/18 ; H01Q21/28 ; H01L23/64 ; H01L25/065 ; H01P3/12 ; H01P3/14 ; H01P5/107 ; H01L23/31 ; H01Q21/06 ; H01L23/498
Abstract:
A package for embedding one or more electronic components comprises a carrier structure a silicon-based carrier layer, one or more electronic components embedded in one or more cavities formed in the carrier layer, and a cover structure arranged on top of the carrier structure. The cover structure comprises a cover layer and one or more cavities formed in the cover layer. An antenna element and/or a waveguide for connection to an antenna element is formed in and/or on top of the cover layer and coupled to the one or more cavities.
Public/Granted literature
- US20160293557A1 PACKAGE AND ANTENNA APPARATUS INCLUDING PACKAGE Public/Granted day:2016-10-06
Information query
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