- Patent Title: Buried contact structures for a vertical field-effect transistor
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Application No.: US15694109Application Date: 2017-09-01
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Publication No.: US10109714B2Publication Date: 2018-10-23
- Inventor: Hui Zang , Tek Po Rinus Lee
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Thompson Hine LLP
- Agent Francois Pagette
- Main IPC: H01L21/82
- IPC: H01L21/82 ; H01L29/417 ; H01L29/66 ; H01L21/285 ; H01L29/10 ; H01L21/311 ; H01L29/78

Abstract:
Structures including a vertical field-effect transistor and fabrication methods for a structure including a vertical field-effect transistor. A vertical field-effect transistor includes a source/drain region located in a section of a semiconductor layer, a first semiconductor fin projecting from the source/drain region, a second semiconductor fin projecting from the source/drain region, and a gate electrode on the section of the semiconductor layer and coupled with the first semiconductor fin and with the second semiconductor fin. The structure further includes a contact located in a trench defined in the section of the semiconductor layer between the first semiconductor fin and the second semiconductor fin. The contact is coupled with the source/drain region of the vertical field-effect transistor.
Public/Granted literature
- US20180254327A1 BURIED CONTACT STRUCTURES FOR A VERTICAL FIELD-EFFECT TRANSISTOR Public/Granted day:2018-09-06
Information query
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