Invention Grant
- Patent Title: Coil electronic component
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Application No.: US15081544Application Date: 2016-03-25
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Publication No.: US10115518B2Publication Date: 2018-10-30
- Inventor: Dong Jin Jeong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2015-0075953 20150529
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/29 ; H01F17/00 ; H01F17/04

Abstract:
A coil electronic component includes a substrate; a coil pattern formed on at least one of first and second main surfaces of the substrate; a body region filling at least a core region of the coil pattern and having a magnetic material; and a magnetic flux controlling part covering at least the coil pattern and having a material having a saturation magnetic flux density higher than that of a magnetic material contained in the body region.
Public/Granted literature
- US20160351318A1 COIL ELECTRONIC COMPONENT Public/Granted day:2016-12-01
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