- Patent Title: Epitaxial substrate for electronic devices, electronic device, method for producing the epitaxial substrate for electronic devices, and method for producing the electronic device
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Application No.: US15538500Application Date: 2015-12-18
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Publication No.: US10115589B2Publication Date: 2018-10-30
- Inventor: Kazunori Hagimoto , Masaru Shinomiya , Keitaro Tsuchiya , Hirokazu Goto , Ken Sato , Hiroshi Shikauchi
- Applicant: SHIN-ETSU HANDOTAI CO., LTD. , SANKEN ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo JP Niiza-shi
- Assignee: SHIN-ETSU HANDOTAI CO., LTD.,SANKEN ELECTRIC CO., LTD.
- Current Assignee: SHIN-ETSU HANDOTAI CO., LTD.,SANKEN ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo JP Niiza-shi
- Agency: Oliff PLC
- Priority: JP2015-002047 20150108
- International Application: PCT/JP2015/006313 WO 20151218
- International Announcement: WO2016/110906 WO 20160714
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L27/108 ; H01L21/02 ; H01L29/78 ; H01L29/778 ; H01L29/20

Abstract:
An epitaxial substrate for electronic devices, including: a Si-based substrate; an AlN initial layer provided on the Si-based substrate; and a buffer layer provided on the AlN initial layer, wherein the roughness Sa of the surface of the AlN initial layer on the side where the buffer layer is located is 4 nm or more. As a result, an epitaxial substrate for electronic devices, in which V pits in a buffer layer structure can be suppressed and longitudinal leakage current characteristics can be improved when an electronic device is fabricated therewith, is provided.
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