Invention Grant
- Patent Title: Incorporation of passives and fine pitch through via for package on package
-
Application No.: US13748294Application Date: 2013-01-23
-
Publication No.: US10115671B2Publication Date: 2018-10-30
- Inventor: Ravindra V. Shenoy , Kwan-Yu Lai , Philip Jason Stephanou , Mario Francisco Velez , Jonghae Kim , Evgeni Petrovich Gousev
- Applicant: QUALCOMM MEMS Technologies, Inc.
- Applicant Address: US CA San Diego
- Assignee: SnapTrack, Inc.
- Current Assignee: SnapTrack, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; G09G3/3266 ; H01L25/00 ; H01L23/15 ; H01L23/498 ; H01L21/48 ; H01L25/10 ; H01L23/31 ; H01L23/50
Abstract:
This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including package-on-packages (PoPs). The glass via bars can provide high density electrical interconnections in the PoPs. In some implementations, the glass via bars can include integrated passive components. Packaging methods employing glass via bars are also provided.
Public/Granted literature
- US20140035892A1 INCORPORATION OF PASSIVES AND FINE PITCH THROUGH VIA FOR PACKAGE ON PACKAGE Public/Granted day:2014-02-06
Information query
IPC分类:
