Invention Grant
- Patent Title: Solder layer of a semiconductor chip arranged within recesses
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Application No.: US14775112Application Date: 2014-03-12
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Publication No.: US10115693B2Publication Date: 2018-10-30
- Inventor: Akihiko Hatasawa
- Applicant: PS4 Luxco S.a.r.l.
- Applicant Address: IE Dublin
- Assignee: LONGITUDE LICENSING LIMITED
- Current Assignee: LONGITUDE LICENSING LIMITED
- Current Assignee Address: IE Dublin
- Agency: Kunzler, PC
- Priority: JP2013-051849 20130314
- International Application: PCT/JP2014/056517 WO 20140312
- International Announcement: WO2014/142178 WO 20140918
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L23/48 ; H01L25/07 ; H01L25/18 ; H01L23/31 ; H01L21/56
Abstract:
One semiconductor chip includes a substrate having insulation properties, a plurality of bump electrodes provided on one surface of the substrate, a plurality of recesses provided in the other surface of the substrate, and a solder layer disposed within the recesses. The recesses are formed such that the area of the opening decreases from the other surface side toward the one surface side of the substrate.
Public/Granted literature
- US20160027755A1 SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE PROVIDED WITH SEMICONDUCTOR CHIP Public/Granted day:2016-01-28
Information query
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