Invention Grant
- Patent Title: Adhesive film and semiconductor package using adhesive film
-
Application No.: US15428452Application Date: 2017-02-09
-
Publication No.: US10115707B2Publication Date: 2018-10-30
- Inventor: Noriyuki Kirikae , Masami Aoyama
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-176257 20140829
- Main IPC: H01L25/065
- IPC: H01L25/065 ; C09J4/00 ; C09J7/00 ; C09J11/06 ; H01L21/52 ; H01L23/00 ; C09J7/02 ; C09J11/04 ; C09J179/08 ; H01L21/683 ; C09J7/20 ; C09J7/30 ; C09J7/25
Abstract:
An adhesive film that can solve the problem of pickup defect and improve the yield rate of semiconductor packages. The adhesive film includes: (A) a bismaleimide resin; (B) a radical initiator; and (C) a coupling agent that contains a (meth)acrylic group. Further, an adhesive film with dicing tape, which includes such an adhesive film laminated onto a dicing tape, is provided. Furthermore, a semiconductor package that includes such an adhesive film with dicing tape is provided.
Public/Granted literature
- US20170152408A1 ADHESIVE FILM AND SEMICONDUCTOR PACKAGE USING ADHESIVE FILM Public/Granted day:2017-06-01
Information query
IPC分类:
