Invention Grant
- Patent Title: Semiconductor device having a superjunction structure
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Application No.: US15694407Application Date: 2017-09-01
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Publication No.: US10115812B2Publication Date: 2018-10-30
- Inventor: Florin Udrea , Alice Pei-Shan Hsieh , Gianluca Camuso , Chiu Ng , Yi Tang , Rajeev Krishna Vytla
- Applicant: Infineon Technologies Americas Corp.
- Applicant Address: US CA El Segundo
- Assignee: Infineon Technologies Americas Corp.
- Current Assignee: Infineon Technologies Americas Corp.
- Current Assignee Address: US CA El Segundo
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/739 ; H01L29/06 ; H01L29/417

Abstract:
A semiconductor device includes a drift region of a first conductivity type, an anode region of a second conductivity type situated below the drift region, an inversion region of the second conductivity type situated above the drift region, an enhancement region of the first conductivity type situated between the drift region and the inversion region, first and second control trenches extending through the inversion region and the enhancement region into the drift region, each control trench being bordered by a cathode diffusion region of the first conductivity type, and a superjunction structure situated in the drift region between the first and the second control trenches so that the superjunction structure does not extend under either the first or the second control trench. The superjunction structure is separated from the inversion region by the enhancement region and includes alternating regions of the first and the second conductivity types.
Public/Granted literature
- US20180012983A1 Semiconductor Device Having a Superjunction Structure Public/Granted day:2018-01-11
Information query
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