Invention Grant
- Patent Title: Electronic component
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Application No.: US15401149Application Date: 2017-01-09
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Publication No.: US10116278B2Publication Date: 2018-10-30
- Inventor: Hayami Kudo , Kenji Nishiyama , Ryo Okura
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Studebaker & Brackett PC
- Priority: JP2016-021107 20160205
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H01F27/28 ; H01F27/40 ; H01G4/012 ; H01G4/08 ; H01G4/40 ; H03H1/00

Abstract:
An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil electrically connected to the lower electrode or the upper electrode. The upper surface of the inorganic dielectric layer is flat.
Public/Granted literature
- US20170230025A1 ELECTRONIC COMPONENT Public/Granted day:2017-08-10
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