Invention Grant
- Patent Title: Method for manufacturing light emitting device
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Application No.: US15977701Application Date: 2018-05-11
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Publication No.: US10117338B2Publication Date: 2018-10-30
- Inventor: Dai Wakamatsu
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Priority: JP2016-246996 20161220
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
A method for manufacturing a light emitting device includes: joining a light transmissive substrate and two or more light emitting elements; separating the light transmissive substrate into a plurality of light transmissive pieces such that one or more of the light emitting elements remains in a state joined to one of the light transmissive pieces; mounting the one or more of the light emitting elements joined to the one of the light transmissive pieces on a mounting unit; removing a portion of the one of the light transmissive pieces such that a top surface of the one of the light transmissive pieces becomes a predetermined shape; and after the removing of the portion of the one of the light transmissive pieces, separating the mounting unit into a plurality of board pieces such that one or more of the light transmissive pieces remain on one of the board pieces.
Public/Granted literature
- US20180263120A1 METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2018-09-13
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