- Patent Title: Cooling architecture for a chassis with orthogonal connector system
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Application No.: US14572401Application Date: 2014-12-16
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Publication No.: US10117358B2Publication Date: 2018-10-30
- Inventor: Ufuk Karaaslan , Ilia Bokchtein , James Crim
- Applicant: VSS Monitoring, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: VSS Monitoring, Inc.
- Current Assignee: VSS Monitoring, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Locke Lord LLP
- Agent Scott D. Wofsy; Christopher J. Capelli
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An electronic equipment chassis assembly includes a housing, and a plurality of openings defined in the housing that allow airflow there-through. The openings include at least one intake opening defined in the front surface of the housing and at least one exit opening defined in the rear surface of the housing. The chassis also includes an air filter, and one or more rails disposed within the housing defining receiving slots that releasably secure a first plurality of circuit boards, and a second plurality of circuit boards, which second plurality of circuit boards are orthogonally oriented relative to the first plurality of circuit boards. The chassis includes an airflow assembly proximate the top surface of the housing, and one or more output fans proximate the rear surface of the housing. The airflow assembly and the output fans balance airflow throughout the chassis.
Public/Granted literature
- US20160174412A1 COOLING ARCHITECTURE FOR A CHASSIS WITH ORTHOGONAL CONNECTOR SYSTEM Public/Granted day:2016-06-16
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