Invention Grant
- Patent Title: Multilayer capacitor and board having the same
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Application No.: US15407473Application Date: 2017-01-17
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Publication No.: US10128048B2Publication Date: 2018-11-13
- Inventor: Heung Kil Park , Jong Hwan Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2016-0049825 20160425
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G4/30 ; H05K1/11 ; H05K1/18

Abstract:
A multilayer capacitor includes a body including a capacitor body formed by layering a plurality of dielectric layers and a plurality of first and second internal electrodes in a width direction, the first and second internal electrodes including body portions overlapping each other and lead portions exposed to a mounting surface of the capacitor body and disposed to be spaced apart from each other, respectively; and first, second and third external electrodes disposed on the mounting surface of the capacitor body to be connected to the lead portions, respectively, wherein the first, second and third external electrodes each include first, second and third electrode layers which are sequentially stacked, the first and second electrode layers containing metal and glass particles, and the third electrode layer containing a conductive resin.
Public/Granted literature
- US20170309403A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME Public/Granted day:2017-10-26
Information query