Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US15807012Application Date: 2017-11-08
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Publication No.: US10128240B2Publication Date: 2018-11-13
- Inventor: Sun Ki Min , Sang Koo Kang , Koung Min Ryu , Gi Gwan Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0150808 20161114
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/088 ; H01L21/311 ; H01L21/8234 ; H01L23/535 ; H01L29/08 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device includes a substrate including first to third regions, wherein the third region is positioned in a first direction between the first and second regions, a fin protruding on the substrate and extending in the first direction, first and second gate structures respectively formed on the fin in the first and second regions, first and second spacers formed with spacing apart from each other on the fin in the third region. The first and second spacers are sloped in a direction away from each other, and the first and second spacers and an upper surface of the fin define a plurality of acute angles, the first and second spacers defining a recess, the fin and the first and second spacers defining sidewalls of the recess, and a device isolating film substantially filling the recess.
Public/Granted literature
- US20180138174A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2018-05-17
Information query
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